Adopting land on the PC board for ensuring the sensor is securely fixed.
Most CFSensor pressure sensor are small size, the thermal capacity of the pressure sensor is low.Therefore, take steps to minimize the effects of external heat.Damage and changes to characteristics may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the pressure sensor is exposed to the atmosphere, do not allow flux to enter inside.
▼ Manual soldering
☉Raise the temperature of the soldering tip between 260 and 300°C/500 and 572°F (30 W) and solder within 5 seconds.
☉The sensor output may vary if the load is applied on the terminal during soldering.
☉Keep the soldering tip clean.
▼DIP soldering (DIP Terminal)
☉Keep the temperature of the DIP solder tank below 260°C/500 and solder within 5 seconds.
☉To avoid heat deformation, do not perform DIP soldering when mounting on the circuit board which has a small thermal capacity.
▼Reflow soldering (SMD Terminal)
☉The recommended reflow temperature profile conditions are given below.
☉We recommend the screen solder printing method as the method of cream.
☉Please refer to the recommended PC board specification diagram for the PC board foot pattern.
☉Self alignment may not always work as expected, therefore, please carefully the position of the terminals and pattern.
☉The temperature of the profile is assumed to be a value measured with the printed wiring board of the terminal neighborhood.
☉Please evaluate solderbility under the actual mounting conditions since welding and deformation of the pressure inlet port may occur due to heat stress depending on equipments or conditions.
▼ Rework soldering
☉Complete rework at a time.
☉Use a flattened soldering tip when performing rework on the solder bridge. Do not add the flux.
☉Keep the soldering tip below the temperature described in the specifications.
▼ Avoid drop and rough handling as excessive force may deform the terminal and damage soldering characteristics.
▼ Keep the circuit board warpage within 0.05 mm of the full width of the sensor.
▼ After soldering, do not apply stress on the soldered part when cutting or bending the circuit board.
▼ Prevent human hands or metal pieces from contacting with the sensor terminal. Such contact may cause anomalous outlets as the terminal is exposed to the atmosphere.
▼ After soldering, prevent chemical agents from adhering to the sensor when applying coating to avoid insulation deterioration of the circuit board.
▼ Correctly wire as in the connection diagram. Reverse connection may damage the product and degrade the performance.
▼ Do not use idle terminals to prevent damages to the sensor.
▼ Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside.
▼ Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.
▼Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip.
▼Since this pressure sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc.
▼Avoid using the pressure sensors chip in an environment where condensation may form.
Furthermore, its output may fluctuate if any moisture adhering to it freezes.
▼The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take
steps to prevent the pressure sensor chip from being exposed to light.
▼Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration.
▼Please keep the sensors sealed using static shielding bags on storage. The PINs of sensor are plated by Ag. If the sensors expose to an atmosphere, the PINs will be black by oxidation.
Quality Check under actual loading conditions
To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance.
Other handling precautions
▼That using the wrong pressure range or mounting method may result in accidents.
▼The only direct pressure medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them.
▼The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked.
▼Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage.
▼Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions.
☉When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the
chips since they readily become charged.
☉ When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged.
▼Based on the pressure involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube.