- For Medical and healthy equipment field, such as Blood pressure test and monitor, Patient Monitoring, Infusion and Syringe Pumps, Anesthesia Machines, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology, Massage device etc.
- For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Emergency Lamp,Sport Equipment etc.
- For Other fields, such as air pump, emergency lamp, dust collector, HVAC and pneumatic device,automotive application etc.
XGZP2604 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear millivolt voltage that is proportional to input pressure.
Chip size is 2.6×2.6×0.4 mm for silicon bonding without glass. With good repeatability, linearity, stability and sensibility, XGZP2604 low pressure sensor die is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.
LOW PRESSURE SENSOR DIE XGZP2604 ORDER GUIDE
More information about low pressure sensor die XGZP2604, refer to Datasheet or contact CFSensor