Matrica industrijskega senzorja tlaka SOI XGZP2406
APLIKACIJE
- For Automotive electronics field, such as tire pressure gauge, MAP sensor etc.
- Za področje gospodinjskih aparatov, such as air compressor etc.
- For Hydraulic control, such as pump,submergence,fire control,jez itd,.
- For Industry field, such as oil,mine,electricity,high-speed railway etc,.
- Za druga področja, such as liquid level measurement,instruments and meters etc.
UVOD
XGZP2406 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class-100 clean room. The pressure sensing chip utilizes a piezoresistive Wheatstone bridge in a design that anodically bonds glass to a chemically etched silicon diaphragm.. Štirje piezo-upori tvorijo strukturo Wheatstonovega mostu. Ko je vzmetna membrana pritisnjena, Wheatstone bridge produces a linear millivolt voltage signal that is proportional to input pressure.
Chip size is 2.4 × 2.4 × 0.62mm(0.094 × 0.094 × 0.024 v) for silicon bonding with glass.It provide a best-in-class operating temperature(-40–180’c)/(-40–356℉)and superior stability.
Z dobro ponovljivostjo, linearnost, stabilnost in občutljivost, XGZP2406 SOI industrial pressure sensor die is also easy for users to calibrate output, thermal drift etc,. by using operational amplifier or integrated circuit.It’s applicable for fluid filled and isolated from measured media,and other simple packaged sensor.
DIMENZIJA (Enota:mm)&ELEKTRIČNI PRIKLJUČEK
VODNIK ZA NAROČANJE
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